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Reliability Comparison of SMD/Chip Power/Through-Hole/Integrated Inductors

2025-10-25

The reliability tests for this type of inductor are divided into environmental tests and physical tests. Environmental tests focus on the inductor's temperature resistance, humidity resistance, thermal shock resistance, etc.; physical tests mainly evaluate the inductor's strength, solderability, reflow soldering performance, drop resistance, impact resistance, etc.

I. Environmental Tests for Inductor ReliabilityMIL-STD-202G Method 108A High-Temperature Storage Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Temperature: 85±2℃
Time: 96±2 hours
Samples shall be placed at room temperature for 1 hour and must be tested within no more than 2 hours.

IEC 68-2-1A 6.1 6.2 Low-Temperature Storage Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Temperature: -25±2℃
Time: 96±2 hours
Samples shall be placed at room temperature for 1 hour and must be tested within no more than 2 hours.

MIL-STD-202G Method 103B Humidity Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Samples must first be dried at 40±5℃ for 24 hours;
Test after drying;
Exposure: Temperature: 40±2℃, Humidity: 93±3% RH, Time: 96±2 hours;
Test in the test chamber after exposure;
Samples shall be placed at room temperature for 1 hour and must be tested within no more than 2 hours.

MIL-STD-202G Method 107G Thermal Shock Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Expose to -40℃ for T minutes, then shock to 125℃ for T minutes as one cycle, with a total of 20 cycles.

II. Physical Tests for Inductor ReliabilityMIL-STD-202G Method 208H IPC-J-STD-002B Solderability TestSolder coverage: The terminals must have more than 95% solder coverage.

Immerse the terminals in flux and then in a 245±5℃ solder bath for 5 seconds;
Solder: Sn(63)/Pb(37);
Flux: Rosin flux.

IPC J-STD-020B Reflow Soldering Test

No obvious appearance defects;
Inductance change does not exceed 10%;
Quality factor change does not exceed 30%;
DC resistance change does not exceed 10%;
Go through the reflow soldering curve (see next page) three times;
Peak temperature: 245±5℃.

MIL-STD-202G Method 201A Vibration Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Vibrate along X, Y, Z directions with a frequency of 10-55Hz and an amplitude of 0.75mm for 2 hours each (total 6 hours).

MIL-STD-202G Method 203C Drop Test

No obvious appearance defects; 2. Inductance change does not exceed 10%;
Quality factor change does not exceed 30%; 4. DC resistance change does not exceed 10%;
Drop the packaged product from a height of 1 meter onto the test board, impacting 1 corner, 1 edge, and 2 faces.

JIS C 5321: 1997 Terminal Strength TestDefinition: A: Welded terminal cross-sectional area A≤8mm², thrust ≥5N;Time: 30 seconds; 8mm²≤20mm², thrust ≥10N;Time: 10 seconds; 20mm², thrust ≥20N;Time: 10 seconds;Bending test: After soldering the product to the PCB, the terminals shall not loosen after thrust test and bending test. Bend the PCB centrally to a deflection of 2mm.

IEC 68-2-45: 1993 Solvent Resistance TestNo appearance damage or marking damage. Immerse in IPA solvent for 5±0.5 minutes, dry at room temperature for 5 minutes, then wipe 10 times.

—— Integrated Inductor ——Integrated inductors also undergo both environmental tests and physical tests. Environmental tests mainly assess temperature resistance, humidity resistance, thermal shock resistance, etc.; physical tests focus on strength, solderability, reflow soldering performance, drop resistance, impact resistance, etc. So what are the standards for integrated inductors?

Environmental Tests for Integrated Inductor ReliabilityHigh-Temperature Storage Test: No obvious appearance defects; inductance change does not exceed 10%; quality factor change does not exceed 30%; DC resistance change does not exceed 10%; Temperature: 85±2℃; Time: Samples shall be placed at room temperature for 1 hour and must be tested within no more than 2 hours.Picture
Physical Tests for Integrated Inductor Reliability(1) Solderability Test: Terminals must have more than 95% solder coverage: Immerse the terminals in flux and then in a 245±5℃ solder bath for 5 seconds; use rosin flux.(2) Reflow Soldering Test: No obvious appearance defects; inductance change does not exceed 10%; quality factor change does not exceed 30%; DC resistance change does not exceed 10%.(3) Vibration Test: No obvious appearance defects; inductance change does not exceed 10%; quality factor change does not exceed 30%; DC resistance change does not exceed 10%; vibrate along X, Y, Z directions with a frequency of 10-55Hz and an amplitude of 0.75mm for 2 hours each (total 6 hours).(4) Drop Test: No obvious appearance defects; inductance change does not exceed 10%; quality factor change does not exceed 30%; DC resistance change does not exceed 10%.
Bending TestSolder the integrated inductor to the PCB; after thrust test and bending test, the terminals shall not loosen. Bend the PCB centrally to a deflection of 2mm.
Solvent Resistance Test for Integrated InductorsUnder the condition of no appearance damage or marking damage, immerse the integrated inductor in IPA solvent for 5±0.5 minutes, dry at room temperature for 5 minutes, then wipe 10 times.